SkyWater and Stanford build a monolithic 3D chip to smash the AI memory wall
Engineers from Stanford, CMU, Penn, and MIT just teamed up with SkyWater Technology to build the first U.S.-made monolithic 3D chip in a commercial foundry. By vertically stacking logic and memory with dense wiring, it bypasses the dreaded "memory wall," boosting speeds up to 12x on Meta's LLaMA workloads. Why it matters: It proves next-gen 3D chip architectures can actually be produced in domestic fabs rather than just cleanrooms.