IBM breaks the 1nm barrier with 3D Nano Stack chips
IBM just unveiled the world’s first sub-1 nanometer chip technology, introducing a 3D "nanostack" architecture at the 0.7nm node. By vertically stacking transistors, the design squeezes nearly 100 billion transistors onto a fingernail-sized chip—doubling density over 2nm with up to 50% higher performance or 70% better efficiency. Why it matters: It proves Moore’s law is still alive, paving the way for atomic-scale hardware to power next-gen AI workloads.